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25 – 100 Ton Hot Pressing Furnaces come with larger chamber sizes and are housed in a large 4 post frame rated at 25 to 100 Ton.
6” (152mm) of travel is standard for increased sample or die sizes. Temperature specifications are 2300°C max. with the press rods installed, 2600°C in batch configuration.
A 12” dia. X 12” high (305mm dia. X 305mm high) usable zone is standard with other sizes available.
Our 5 Ton (44.4KN) and 10 Ton (88.9 kN) hot pressing furnace have a two post load frame and are capable of temperatures up to 2300C in gas or vacuum, 2600C in batch configuration. Travel 4” (101mm) with 0.001” (0.01mm) control increments, Pressure Control with 1lbs (4N) Force increments
MRF’s 15 Ton Hot Pressing Furnaces are available with larger hot zone sizes and are housed in a larger frame able to handle the higher forces and samples. Temperature and material specifications are similar to the HP 5-10 Ton model, 2300°C max. with the press rods installed, 2600°C in batch configuration.
Crystal growing kit uses the top chamber port of select front loading furnaces. The crystal pulling speed is adjustable and controls accurately as low as 0.001”/min. (0.025mm/min). Seed rod rotation motor is also provided. The Crystal Growing Kit allows crystals to be produced with the Bridgman ,Czochralski or Stepanov method.
Our two-station sintering furnace is based on our bottom loading sintering furnace, but is capable of simultaneously processing two loads, essentially doubling throughput within the same footprint. Our sintering furnaces are widely found in the electronics industry for sintering or heat treating electronic components at high temperatures. Cycles consist of atmosphere preparation, heating, rapid cooling and controlled oxidation.
Tailored for high temperature sintering of electronic components. Cycles consist of atmosphere preparation, heating, forced cooling and controlled oxidation. This furnace has a usable zone of 12” dia. x 22” high (305mm dia. x 559mm high), and is suited for large batch processing.